KUALA LUMPUR: Integrated industrial packaging solutions provider L&P Global Bhd (L&P) has appointed Lee Soon Swee as the group’s executive director, effective November 13, 2024.
Lee has over 30 years of experience in engineering, specialising in applied science and laboratory research and development (R&D) work across aerospace, semiconductor, and life science industries.
He has held technical and leadership roles in organisations such as the National Institute of Aviation Research and MEMC Electronic Materials Inc in USA, Applied Materials Southeast Asia Pte Ltd and TMC Life Sciences Bhd in Malaysia, and Pall Corporation in Malaysia and Singapore.
Throughout his career, Lee has driven technical innovation, engaging in the development of advanced composite materials, optimising processes for fabrication of integrated circuits, resolving micro contamination issues and designing lab equipment to improve clinical outcomes in medical technology.
Commenting on the appointment, L&P executive director and CEO Ooi Lay Pheng said Lee’s proven track record in R&D and material science positioned the company to explore innovative packaging solutions that not only address customers’ evolving needs but also open opportunities for expansion into new market segments.
“This aligns with our forward-thinking approach, exemplified by our previous diversification into engineered wood for our packaging products to enhance product quality and throughputs.
“By leveraging on Lee’s technical leadership and process engineering skills, we aim to further optimise our operations and enhance operational efficiencies,“ she said.
Lee holds a Bachelors of Science degree in Aerospace Engineering and a Masters of Science in Mechanical Engineering from Wichita State University, USA.
