Intel’s RM30 billion advanced packaging plant in Malaysia, set to open this year, is a key driver for high-value jobs and a greater role in the global semiconductor ecosystem.
KUALA LUMPUR: A RM30 billion investment by Intel Corporation is poised to drive a new phase for Malaysia’s semiconductor industry.
MIDA chairman Tengku Zafrul Tengku Abdul Aziz said the investment in an advanced packaging facility surpasses the significance of Intel’s cumulative RM49.3 billion investment over 54 years.
The new facility is nearly complete and expected to begin operations this year.
He stressed the priority is to fully leverage this to expand a high-value industrial ecosystem.
“This is not just an investment. This is about opportunities for our people – high-value jobs, future skills, and a role in the global chip industry,” he wrote on social media platform X.
Tengku Zafrul added that Malaysia faces a choice between remaining a technology consumer or emerging as a technology creator.
