Apple is in early talks with Indian chipmakers to assemble and package iPhone components, potentially at a new Gujarat facility.
NEW DELHI: Apple is in early discussions with Indian chipmakers to assemble and package components for the iPhone.
The Economic Times reported the talks, citing people familiar with the matter.
This marks the first time Apple has considered assembling and packaging some chips within India.
The report said it is unclear which chips will be packaged at the Sanand facility in Gujarat, though they are likely display chips.
Apple held talks with Murugappa Group-owned CG Semi, which is building an outsourced semiconductor assembly and test (OSAT) facility in Sanand.
Reuters could not immediately verify the ET report.
Apple and CG Semi did not immediately respond to Reuters’ request for comment.
CG Semi told ET that it does not comment on market speculation or discussions with specific customers.
“We will make appropriate disclosures as and when there is something concrete to share,” the company told the newspaper.
Apple has been aiming to make most of its iPhones sold in the United States at factories in India by the end of 2026.
The company is speeding up those plans to navigate potentially higher tariffs in China, its main manufacturing base.
In April, the U.S. administration imposed 26% duties on imports from India, far lower than the more than 100% levied on Chinese goods at the time.
Washington has since paused most duties for three months, except those on China. – Reuters
