Intel’s new advanced packaging and assembly facility in Malaysia will begin operations later this year, marking a major expansion of its investment in the country
KUALA LUMPUR: Intel’s investment in Malaysia is set to grow with its most advanced packaging and assembly manufacturing complex beginning operations later this year.
Prime Minister Datuk Seri Anwar Ibrahim said he received a briefing from Intel Corporation CEO Tan Lip-Bu and his team on the latest developments regarding the expansion.
“The discussion focused on efforts to support the development of the advanced packaging complex as well as assembly and testing, which are key components of Intel’s investment expansion in Malaysia,” Anwar said in a social media post.
Intel Foundry Executive Vice President and General Manager Naga Chandrasekaran outlined plans to start the first phase of the complex with assembly and testing for advanced packaging.
“I welcome Intel’s decision to start operations for the complex later this year,” the Prime Minister said.
He added that emphasis was also placed on continuous training and upskilling of local talent throughout the value chain.
This is crucial for the government’s efforts to generate high-value jobs in line with MADANI Economy aspirations.
“The MADANI Government machinery will continue to be a partner and facilitator for investments that will clearly provide long-term benefits as targeted in launched plans including the National Semiconductor Strategy,” he said.
